Rigid PCB Process Capability
Layer:1~22 layers
Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg
Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating
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						 | 
						 | 
						 | English | Metric | 
| 1 | Max. Panel Size | 
						 | 22" x 26" | 550 x 650mm | 
| 2 | Mechanical Drill | 
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						 | 
						 | 
| 
						 | Min. Finished Holes Size | 
						 | 0.004" | 0.10mm | 
| 
						 | Finished Holes Tolerance | PTH | ¡À0.003" | ¡À0.075mm | 
| 
						 | 
						 | NPTH | ¡À0.002" | ¡À0.050mm | 
| 
						 | 
						 | Press Fit | ¡À0.002" | ¡À0.050mm | 
| 
						 | Aspect Ratio | 
						 | 9 : 1 | 9 : 1 | 
| 3 | Laser Drill | 
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						 | 
						 | 
| 
						 | Microvias diameter | 
						 | 0.004" - 0.006" | 0.10 - 0.15mm | 
| 
						 | Aspect Ratio | 
						 | 1 : 1 | 1 : 1 | 
| 4 | Min. Line Width/Spacing | ½oz / 18um | 0.003" / 0.003" | 0.075 / 0.075mm | 
| 
						 | 
						 | 1oz / 35um | 0.006" / 0.006" | 0.15 / 0.15mm | 
| 
						 | 
						 | 2oz / 70um | 0.008" / 0.008" | 0.20 / 0.20mm | 
| 
						 | 
						 | 3oz / 105um | 0.010" / 0.010" | 0.25 / 0.25mm | 
| 5 | Registration | 
						 | 
						 | 
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| 
						 | Solder Mask | 
						 | ¡À0.003" | ¡À0.075mm | 
| 
						 | Layer to Layer | 
						 | ¡À0.0024" | ¡À0.060mm | 
| 
						 | Copper Feature to Holes(Outer) | 
						 | ¡À0.003" | ¡À0.075mm | 
| 
						 | Min. Plated Drills to Copper (inner) | 2L - 8L | 0.010" | 0.25mm | 
| 
						 | 
						 | 10L -22L | 0.012" | 0.30mm | 
| 6 | Board Outline | 
						 | 
						 | 
						 | 
| 
						 | Edge to Edge Tolerance | 
						 | ¡À0.004" | ¡À0.10mm | 
| 
						 | Holes to Edge Tolerance | 
						 | ¡À0.004" | ¡À0.100mm | 
| 
						 | Min. Copper to Edge distance | Outer | 0.010" | 0.25mm | 
| 
						 | 
						 | Inner | 0.016" | 0.40mm | 
| 7 | Max. Copper Thickness | 
						 | 4oz | 140¦Ìm | 
| 8 | Max. Board Thickness | 
						 | 0.189" | 4.80 mm | 
| 9 | Min Board Thickness | 2L | 0.008" | 0.20mm | 
| 
						 | 
						 | 4L | 0.016" | 0.40mm | 
| 
						 | 
						 | 6L -22L | 0.020" | 0.60mm | 
| 10 | Min. Core Thickness | 
						 | 0.004" | 0.10mm | 
| 11 | Min. Soldermask Dam | 0.004" | 0.10mm | |
| 12 | Controlled Impedance (Ohm) | ¡À7% - 10% | ¡À7% - 10% | |
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