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Rigid PCB Process Capability

2021/9/15 11:25:17 Click£º1270
 

Layer:1~22 layers

Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg

Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating




English

Metric

1

Max. Panel Size


22" x 26"

550 x 650mm

2

Mechanical Drill





Min. Finished Holes Size


0.004"

0.10mm


Finished Holes Tolerance

PTH

¡À0.003"

¡À0.075mm



NPTH

¡À0.002"

¡À0.050mm



Press Fit

¡À0.002"

¡À0.050mm


Aspect Ratio


9 : 1

9 : 1

3

Laser Drill





Microvias diameter


0.004" - 0.006"

0.10 - 0.15mm


Aspect Ratio


1 : 1

1 : 1

4

Min. Line Width/Spacing

½oz / 18um

0.003" / 0.003"

0.075 / 0.075mm



1oz / 35um

0.006" / 0.006"

0.15 / 0.15mm



2oz / 70um

0.008" / 0.008"

0.20 / 0.20mm



3oz / 105um

0.010" / 0.010"

0.25 / 0.25mm

5

Registration





Solder Mask


¡À0.003"

¡À0.075mm


Layer to Layer


¡À0.0024"

¡À0.060mm


Copper Feature to Holes(Outer)


¡À0.003"

¡À0.075mm


Min. Plated Drills to Copper (inner)

2L - 8L

0.010"

0.25mm



10L -22L

0.012"

0.30mm

6

Board Outline





Edge to Edge Tolerance


¡À0.004"

¡À0.10mm


Holes to Edge Tolerance


¡À0.004"

¡À0.100mm


Min. Copper to Edge distance

Outer

0.010"

0.25mm



Inner

0.016"

0.40mm

7

Max. Copper Thickness


4oz

140¦Ìm

8

Max. Board Thickness


0.189"

4.80 mm

9

Min Board Thickness

2L

0.008"

0.20mm



4L

0.016"

0.40mm



6L -22L

0.020"

0.60mm

10

Min. Core Thickness


0.004"

0.10mm

11

Min. Soldermask Dam

0.004"

0.10mm

12

Controlled Impedance (Ohm)

¡À7% - 10%

¡À7% - 10%