1. Cutting

(1). Cutting process: picking-cutting

(2). The purpose of cutting: cut large-size incoming materials into the size required for production

(3). Precautions for opening materials: ①Check the size of the first piece when opening the first piece; ②Pay attention to scratches on the aluminum surface and copper surface; ③ Pay attention to the delamination and the front edge of the board

2. Drilling

(1). The process of drilling: dowel-drilling-board inspection

(2). Purpose of drilling: positioning and drilling the plate to assist the follow-up production process and customer assembly

(3). Precautions for drilling: ①Check the number of holes and the size of the holes; ②Avoid scratching of the sheet; ③Check the aluminum surface and the deviation of the hole position; ④Check and replace the drill tip in time; ⑤Drill the hole Divided into two stages, one drilling: drilling is the peripheral tool hole after the material is cut; the second drilling: the tool hole in the unit after the solder mask

3, dry/wet film imaging

(1). Dry/wet film imaging process: grinding plate — filming — exposure — development

(2). The purpose of dry/wet film imaging: present the parts needed to make the circuit on the sheet

(3). Precautions for dry/wet film imaging: ①Check whether the circuit is open after development; ②Whether there is deviation in the development alignment to prevent the occurrence of dry film breakage; ③Pay attention to the poor wiring caused by scratches on the board; ④No damage during exposure Air remains to prevent poor exposure; ⑤After exposure, stay still for more than 15 minutes before developing

4. acid/alkaline etching

(1). Acid/alkaline etching process: etching — stripping — drying — inspection board

(2). Purpose of acid/alkaline etching: After imaging the dry/wet film, retain the required circuit parts, and remove the excess parts other than the circuit. Pay attention to the corrosion of the etching solution on the aluminum substrate during acid etching;

(3). Precautions for acid/alkaline etching: ①Pay attention to unclean etching and excessive etching; ②Pay attention to line width and line spacing; ③No oxidation or scratching on the copper surface; ④Remove the dry film to be clean

5, silk screen solder mask, characters

(1). Silk screen solder mask and character process: silk screen — pre-baking — exposure — development — characters

(2). The purpose of the silk screen solder mask and characters: ① Solder protection: protect circuits that do not need to be soldered, and prevent tin from entering to cause short circuits; ② Characters: play a role in marking

(3). Precautions for screen printing solder mask and characters: ①Check whether there is rubbish or foreign matter on the board surface; ②Check the cleanliness of the screen; ③Pre-bake for more than 30 minutes after screen printing to avoid air bubbles between the lines; ④Pay attention to the screen printing Thickness and uniformity; ⑤After pre-baking, the board should be completely cooled to avoid staining the film or destroying the gloss of the ink surface; ⑥Place the ink face down during development;

6. V-CUT, gong board

(1). The process of V-CUT and gong board: V-CUT-gong board-tear off the protective film-remove the front;

(2). The purpose of V-CUT and gong board: ①V-CUT: connect a single PCS circuit with a small part of the PNL plate cutting to facilitate packaging and taking out; ②Gong board: remove the excess part of the circuit board

(3). Precautions for V-CUT and gongs: ① Pay attention to the size of V, incomplete edges and burrs during the V-CUT process; ② Pay attention to the burrs and deflection of gongs when gongs, check and replace the gongs in time; ③Finally, avoid scratches on the board surface when removing the front

7. Test, OSP

(1). Test, OSP process: line test — withstand voltage test — OSP

(2). The purpose of the test, OSP: ①Line test: to detect whether the completed line is working normally; ②Withstand voltage test: to detect whether the completed line can withstand the specified voltage environment; ③OSP: to make the line better soldered

(3). Precautions for testing and OSP: ①How to distinguish between qualified and unqualified products after testing; ②Placement after OSP; ③Avoid circuit damage

8. FQC, FQA, packaging, shipping

(1). Process: FQC — FQA — Packaging — Shipment

(2). Purpose: ①FQC conducts full inspection and confirmation of the product; ②FQA sampling verification; ③Packing and shipping to customers as required

(3). Attention: ①FQC pays attention to the confirmation of appearance during the visual inspection process, and makes a reasonable distinction; ②FQA really conducts random inspection and verification of FQC inspection standards; ③Confirm the number of packages to avoid mixed boards, wrong boards and packaging damage.