FAQ on How is PCB produced or the PCB Production Process
The brief production process of Printed Circuit Board(PCB) is described in details as following:
Material Cutting
Purpose: According to the requirements of the engineering MI(Manufacturing Instruction) data, cut large sheets CCL(Copper Clad Laminate) material into small size working plates which meet the requirements.
Process: large sheet material ¡ú cutting board according to MI requirements ¡ú curly board ¡ú beer fillet edging ¡ú output board
Drilling
Purpose: According to the engineering data, the required diameter holes are drilled in the corresponding position on the working plates that meet the required size.
Process: stack board pin ¡ú load board ¡ú drilling ¡úunload board ¡ú inspection and repair
Immersion Via Copper
Purpose: Immersed copper deposits a thin layer of copper on the wall of via holes using chemical methods.
Process: rough grinding ¡ú hanging board ¡ú automatic immersion copper line ¡ú unloading board ¡ú immersed in% dilute H2SO4 ¡ú thickened copper
Graphics Transferring
Purpose: Graphic Transferring is to transfer the layout image of production film to the board.
Process: (Blue oil process): grinding board¡ú printing the first side¡ú drying¡ú printing the second side¡ú drying¡ú UV Exposure¡ú Shading¡ú Checking
(dry film process): hemp board¡ú pressing the film¡ú stand still¡ú right Bit¡ú UV Exposure¡ú Stay¡ú developing¡ú Checking
Graphic Plating
Purpose: Graphic plating is to plate a copper layer with a required thickness and a gold nickel or tin layer on the bare copper skin of the circuit pattern or the via holes wall.
Process: load board ¡ú degreasing ¡ú secondary washing with water ¡ú micro-etching ¡ú water washing ¡ú acid washing ¡ú copper plating ¡ú water washing ¡ú acid immersion ¡ú tin plating ¡ú water washing ¡ú unload board
Retreat
Purpose: Remove the anti-electroplating coating layer with NaOH solution to expose the non-circuit copper layer.
Process: (oil film process) insert frame ¡ú soak in alkali ¡ú rinse ¡ú scrub ¡úRetreat Machine Process
(dry film process) put plate ¡ú Retreat Machine Process
Etching
Purpose: Etching is to etch away the copper layer of non-circuit parts by chemical reaction method.
Green Solder Mask
Purpose: Green Solder Mask is to transfer the graphics of green solder mask film to the board to protect the circuit and prevent tin on the circuit when welding parts.
Process: Grinding board¡ú printing photosensitive green solder mask¡ú curing board¡ú UV Exposure¡ú printing shadow; grinding board¡ú printing first side¡ú baking board¡ú printing second side¡ú baking board
Silk Screen
Purpose: The silk screen is an easy-to-be-recognized mark provided.
Process: After the green solder mask is finally pressed ¡ú cooling and standing by¡ú adjusting the stencil ¡ú printing Silk Screen¡ú back pressing
Gold-plated Fingers
Purpose: To plate a nickel-gold layer with a required thickness on the plug fingers to make it more rigid and wear-resistant.
Process: load plate ¡ú degreasing ¡ú washing twice ¡ú micro-etching ¡ú washing twice ¡ú pickling ¡ú copper plating ¡ú washing ¡ú nickel plating ¡ú washing ¡ú gold plating
HASL (a parallel process)
Purpose: HASL is to spray a layer of lead and tin on the bare copper surface not covered with solder mask oil to protect the copper surface from corrosion and oxidation to ensure good welding performance.
Process: micro-erosion ¡ú air drying ¡ú preheating ¡ú rosin coating ¡ú solder coating ¡ú hot air leveling ¡ú air cooling ¡ú washing and air drying
Forming
Purpose: The method of forming the shape required by the customer through die punching, CNC routing machine, V-cutting
E-Testing
Purpose: 100% Pass the Electronic Testing to detect defectives that affect functionality, such as open circuits and short circuits that are not easily found visually.
Process: set up testing tooling ¡ú load board ¡ú test ¡ú qualified ¡ú FQC visual inspection/ unqualified ¡ú repair ¡ú return to test ¡ú OK ¡ú REJ ¡ú scrap
Final Inspection
Purpose: To visually inspect the appearance defectives of the board through 100% and repair minor defects to avoid the outflow of defective boards.
Process: incoming material ¡ú view data ¡ú visual inspection ¡ú qualified ¡ú FQA spot check ¡ú qualified ¡ú packaging / unqualified ¡ú processing ¡ú inspection OK
If any question on PCB Production Process, or if you want to know How is the PCB produced step by step, please feel free to contact us: market@chenghogroup.com
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