Orbotech: How China Moves Up the Value Chain
Yair Alcobi, Vice President of Orbotech, talks to I-Connect007 China Editor Edy Yu about the latest AOI equipment the company is introducing in China and the Asia market, including the Ultra Fusion 200--a new platform for addressing the needs of IC makers.
Based on the Fusion platform introduced to the market last year, Alcobi said the Ultra Fusion 200 is the next-generation of AOI for IC substrates, featuring a special optical head and the unique multi-image technology.
Alcobi also discusses how China has progressed from focusing on high-volume, low-end production, to moving up the PCB value chain by getting the latest technologies available in the market.
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